Description
High-Precision Thermal Imaging in a Compact Form
The XTM Thermal Module from Exosens combines compact size, versatility, and high-performance thermal imaging in a single, modular core. Designed with an uncooled 640 x 480 pixel microbolometer and a 17 μm pixel pitch, XTM modules provide precise thermal detection in the Long Wave Infrared (8–14 μm) spectrum. Its NETD of <50 mK (with <30 mK available upon request) ensures accurate measurement of temperature differences even in demanding environments.
Modular Design for Easy Integration
The XTM series offers multiple output options, including GigE, CameraLink, and 16-bit Digital Video, making it compatible with a wide range of systems. Its rolling shutter integration ensures smooth thermal imaging while enabling advanced features such as configurable regions of interest (ROI) and fast integration times (1–80 μs). Compact dimensions (as small as 36 x 45 x 45 mm) and lightweight design facilitate integration into UAVs, armored vehicles, handheld devices, and industrial platforms.
Rugged Performance for Extreme Conditions
Engineered to meet industrial and defense standards, XTM modules endure harsh conditions with MIL-STD810G-certified shock (40 g, 11 ms) and vibration (5 g, 20–2000 Hz) resilience. The operational temperature range of -40°C to +60°C allows reliable function in extreme climates. Low power consumption (2.7–4.6 W depending on model) ensures efficiency in portable and battery-powered systems.
XTM Thermal Modules are ideal for applications in defense and surveillance, law enforcement, border and maritime monitoring, search and rescue, industrial inspection, machine vision, firefighting, and transportation monitoring. Their combination of compactness, precision, and ruggedness makes them an optimal solution for modern thermal imaging challenges.
Technical Specifications
| Model | Pixel Pitch | Resolution | Spectral Range | Max Frame Rate | NETD | Power Consumption | Operating Temp | Output Options | Dimensions (mm) | Weight (g) |
| XTM+ 640 GigE | 17 μm | 640×480 | 8–14 μm | 60 Hz | <50 mK (<30 mK optional) | 4.6 W | -40°C to +60°C | GigE | 45 x 45 x 63 | 125 |
| XTM+ 640 CL | 17 μm | 640×480 | 8–14 μm | 60 Hz | <50 mK (<30 mK optional) | 2.7 W | -40°C to +60°C | CameraLink | 45 x 45 x 36 | 72 |
| XTM+ 640 16bit DV | 17 μm | 640×480 | 8–14 μm | 60 Hz | <50 mK (<30 mK optional) | 2.7 W | -40°C to +60°C | 16-bit DV | 45 x 45 x 36 | 72 |
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