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Jasper is a COM Express carrier board and SBC for Type 6 Basic (125x95mm) and Compact (95x95mm) modules. It is designed for applications that require ruggedness, a high level of I/O, or extended product lifetime. Notable features of Jasper include:
Rugged mechanical design with thicker PCB and latching connectors
Wide temperature operation – up to -40 to +85C (depending on the installed COM)
Built-in 16-bit data acquisition circuit with autocalibration
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory and network connectivity
PCIe/104 expansion socket supporting x16 and x1 links
Jasper is available as a carrier board alone, for user integration with a COM of your choice, or as a ready-to-run “single-board computer” with an 11th generation Intel Xeon processor COM installed. Both Windows and Linux OS support are standard, while other OS support is available upon request.
Flexible Design to Fit Any Application
The most popular I/O on Jasper is provided on a single row of connectors along the front edge of the PCB. This arrangement supports dual connection modes. First Jasper can be used with traditional cables, with each cable providing a positive locking feature for increased shock and vibration resistance. Secondly, the single row of connectors makes it easy to design and build I/O connector boards that match the end application’s exact requirements. For example, a connector board with commercial connectors (RJ-45, USB type A, etc.) or MIL-DTL-38999 rugged circuit connectors can be plugged directly into the Jasper I/O connectors to create a “cable-free” solution. Such a connector board can dramatically reduce assembly time and cost for the end system.
Rugged design
Jasper was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications:
The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints
Almost all I/O connectors are positive latching (not friction lock) for increased ruggedness
A bottom-side heat spreader provides more efficient cooling than a traditional heat sink.
All components are rated and/or tested to ensure reliable -40 to +85 o C operation
Thermal Dissipation
Jasper supports installation of the COM and its heat spreader on the bottom side of the carrier. This enables more efficient mounting and heat dissipation, since the COM’s heat is directly coupled to the enclosure body instead of relying on a top-side heat sink to dissipate heat into the air inside. Jasper’s mounting plate surrounds the COM heat spreader to provide mounting stability for the entire board assembly.
I/O Expansion
Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of wifi and other networking modules. The PCIe/104 socket enables use with PCIe/104 Type 1 I/O modules using x1, x4, x8, and x16 PCIe links (depending on the capability of the installed COM) as well as PCIe/104 OneBank modules using the x1 lanes on the first connector bank.
Cable Kit
The Jasper cable kit includes cables for all I/O and features on the board. All cables except for SATA have positive latching feature for resistance to shock and vibration.
Key Features
Supports COM Express Type 6 Basic & Compact modules
Available as complete solution with Intel 11th Gen Core i7 COM / up to 64GB RAM
Dual PCIe MiniCard sockets with PCIe, SATA, and USB support
M.2 (NVME/SATA) and SATA connectors for mass storage
Data acquisition with 16 A/D, 4 D/A, 16 GPIO
PCIe/104 expansion with PCIe x1 and x16 links
12V or 18-36VDC Input
-40C to +85C operating temperature (depending on installed COM)
Dimensions: 5.75”W x 4.00”H / 146/102mm (3.5 inch form factor)
Key Benefits
Reduces number of boards needed, lowering system size and cost
High-quality analog and digital I/O features for professional applications
Comprehensive and versatile subsystem with top-tier software support
Easy to assemble and maintain, ensuring reliable performance
Precision timing and sampling with built-in counter/timers and FIFO
Flexible and programmable I/O options tailored to various needs
Real-time rate and duty cycle updates for pulse width modulators
User-friendly software and graphical control panel for efficient system debugging and testin
Trust the Experts at Integrys
For more than 50 years, Integrys has been the industry leader in selecting and evaluating rugged and embedded computers, imaging and video technology and engineering solutions.
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The Sabre series consists of two product categories:
