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DX-1200 Rugged Embedded Computer

DX-1200 Rugged Embedded Computer

13/12th Gen. Intel® Core Series High Performance and Compact Rugged Embedded Computer

PRODUCTS FEATURES:
  • Intel® 13/12th Gen Raptor Lake-S / Alder Lake-S Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
  • 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
  • Quad Independent Display (HDMI / DP / DVI-I)
  • 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
  • CMI Technology for Optional I/O Module Expansions
  • CFM Technology for Power Ignition Sensing & PoE Function
  • Wide Operating Temperature -40°C to 70°C
  • Safety Standard: UL, cUL, CB, IEC, EN 62368-1

 

SKU: DX1200 Categories: ,

Description

The DX-1200 Rugged Embedded Computer is a high-performance, fanless solution built to handle industrial and edge AI applications. Powered by Intel® 13th/12th Gen Raptor Lake-S/Alder Lake-S Core™ processors with up to 24 cores and 32 threads, it delivers exceptional computing power for smart manufacturing, machine vision, and IoT environments. Its robust chassis and wide operating temperature range (-40°C to 70°C) ensure reliable performance in extreme conditions.

This compact system (242 x 173 x 75 mm) supports quad independent displays and features DDR5 memory (up to 64GB) with ECC support for enhanced reliability. The DX-1200 also offers modular expansion capabilities with M.2 and Mini PCIe slots, enabling seamless integration of wireless communication, 5G, PoE, and custom I/O modules. Certified to industrial and military standards, including MIL-STD-810G and EN 50155, it is a versatile, future-proof platform for critical applications.

Rapid Processing and Inference

The DX-1200 supports 13/12th gen Intel® Core™ i9/i7/i5/i3 (Raptor Lake-S/Alder Lake-S) processors based on the Intel 7 process, with up to 24 cores (8P + 16E) and 32 threads, delivering more than 1.35x the speed of Comet Lake-S platform. The Intel® Xe architecture of the UHD 770 graphics chip boosts GPU image classification inference performance to 2.8× the speed of Comet Lake-S, providing the processing performance needed for AI and edge computing.

High-speed, Safe Memory

Two DDR5 SO-DIMM slots support up to 64GB of 4800MHz memory and include ECC (Error Correction Code) technology, giving the extra stability and reliability needed for industrial automation applications.

Rich and Diverse Expandability

To cater to the widest range of industrial applications, the DX-1200 provides one M.2 Key E slot and two Mini PCIe slots for the addition of WiFi, GNSS, 4G, and Bluetooth. The Mini PCIe slots also support I/O expansion cards, frame grabber cards, and more, to meet different application requirements.

High-speed, Reliable Data Transmission

To improve the transfer rate of videos or large files, the DX-1200 supports up to four high-speed 10Gbps LAN ports. And for application environments that require multiple network connections, the DX-1200 supports up to 8× PoE, providing data and power through the same cable to reduce the difficulty of wiring.

Robust and Reliable

The DX-1200 is built tough, reflected in its industrial-grade protection design and industry certifications in different fields. In addition to features such as wide temperature (-40 – 70°C), wide voltage input (9 – 48 VDC), overvoltage, overcurrent, and ESD protection, it also complies with the US military shock vibration standard MIL-STD-810G. Product safety and reliability are further ensured with internationally recognized UL 62368-1 safety certification. For more secure railway computing, it also passes the EMC EN 50121-3-2 standard in EN 50155 and the EN 45545-2 fire protection standard.

 

Specification of DX-1200 Rugged Embedded Computer:

Model Name DX-1200
System Processor 13th Generation Intel® Raptor Lake-S Series CPU:
– Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W
– Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W
– Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W
– Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W
– Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W
– Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W
– Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W
– Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W
– Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W12th Generation Intel® Alder Lake-S Series CPU:
– Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W
– Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
– Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W
– Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
– Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
– Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
– Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W
– Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
– Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W
– Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W
– Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W
– Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W
Chipset Intel R680E Chipset
Memory 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64GB
BIOS AMI BIOS
Graphics Graphics Engine Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
Integrated Intel® UHD Graphics 730: Core™ i3
Integrated Intel® UHD Graphics 710: Pentium®/Celeron®
Maximum Display Output Supports Quad Independent Display
DVI 1x DVI-I Connector
– VGA: 1920 x 1080 @ 60 Hz
– DVI-D: 1920 x 1200 @ 60 Hz
DP 1x DP Connector: 4096 x 2304 @ 60Hz
* Verified maximum resolution: 3840 x 2160 @ 60Hz
HDMI 1 x HDMI Connector (3840×2160@30Hz)
Audio Audio Codec Realtek® ALC888, High Definition Audio
Line-out 1x Line-out, Phone Jack 3.5mm
Mic-in 1x Mic-in, Phone Jack 3.5mm
I/O LAN 2x 1GbE LAN, RJ45(Supports Wake on LAN, PXE)
– GbE1: Intel® I219
– GbE2: Intel® I210
COM 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
USB 4 x USB 3.2 Gen2x1 (10Gbps), Type A
4 x USB 3.2 Gen1x1 (5Gbps), Type A
Storage SSD/HDD 2x 2.5″ SATA HDD/SSD Bay (SATA 3.0)
mSATA 2x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket )
RAID Support RAID 0/1/5/10
Expansion Mini PCI Express 2x Full-size Mini-PCIe Socket
M.2 E Key Socket 1x M.2 Key E Type 2230 Socket, Support Intel CNVi Module
SIM Socket 1x SIM Socket
CMI (Combined Multiple I/O) Interface 2x High Speed CMI Interface for optional CMI Module Expansion
1x Low Speed CMI Interface for optional CMI Module Expansion
CFM (Control Function Module) Interface 1x CFM IGN Interface for optional CFM-IGN Module Expansion
Other Function External FAN Connector 1x External FAN Connector, 4-pin Terminal Block
(Support Smart Fan by BIOS)
Clear CMOS Switch 1x Clear CMOS Switch
Reset Button 1x Reset Button
Instant Reboot Support 0.2sec Instant Reboot Technology
Watchdog Timer Software Programmable Supports 256 Levels System Reset
Power Power Button 1 x ATX Power On/Off Button
Power Mode Switch 1 x AT/ATX Mode Switch
Power Input 9 – 48VDC, 3-pin Terminal Block
Remote Power On/Off 1 x Remote Power On/Off, 2-pin Terminal Block
Max. Power Consumption • 35W CPU
– OS Idle Mode: 86.14 W
– Full Loading: 201.17 W
• 65W CPU
– OS Idle Mode: 99.89 W
– Full Loading: 274.80 W
Inrush Current (Peak) • 35W CPU: 4.151 A@24V
• 65W CPU: 4.360 A@24V
Physical Dimension ( W x D x H ) 242 x 173 x 75 mm
Weight Information 3.05 kg
Mechanical Construction Extruded Aluminum with Heavy Duty Metal
Mounting Wall / DIN-RAIL / VESA / Side Mount
Physical Design • Fanless Design
• Cableless Design
• Jumper-less Design
• Unibody Design
Reliability & Protection Reverse Power Input Protection Yes
Over Voltage Protection • Protection Range: 51~58V
• Protection Type: shut down operating voltage, re-power on at the preset level to recover
Over Current Protection 15A
CMOS Battery Backup SuperCap Integrated for CMOS Battery Maintenance-free Operation
MTBF 394,488 Hours – Database: Telcordia SR-332 Issue3, Method 1, Case 3
Operating System Windows Windows®11, Windows®10
Linux Ubuntu 22.04
Environment Operating Temperature • 35W TDP Processor: -40°C to 70°C
• 65W TDP Processor: -40°C to 50°C (With External Fan Kit)
– With extended temperature peripherals; Ambient with air flow
– According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
Storage Temperature -40°C to 85°C
Relative Humidity 95% RH @ 70°C (Non-condensing)
Shock MIL-STD-810G
Vibration MIL-STD-810G
EMC • CE, UKCA, FCC, ICES-003 Class A
• EN 50155 (EN 50121-3-2 Only)
• E-Mark
EMI • CISPR 32 Conducted & Radiated: Class A
• EN/BS EN 50121-3-2 Conducted & Radiated: Class A
• EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
• EN/BS EN61000-3-3 Voltage fluctuations & flicker
• FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
EMS • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
• EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
• EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
• EN/IEC 61000-4-5 Surges: AC Power: 2 kV
• EN/IEC 61000-4-6 CS: 10V
• EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
• EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz
Safety UL, cUL, CB, IEC, EN 62368-1
Fire Protection EN 45545-2

 

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