Description
The DS-1400 Series Rugged Embedded Computer offers high performance and modular expandability for industrial and edge computing applications. Powered by Intel® 13th/12th Gen Raptor Lake-S/Alder Lake-S processors, with up to 24 cores and 32 threads, it delivers exceptional computing power and advanced GPU capabilities for AI and machine vision tasks. The system supports dual PCI/PCIe slots for custom I/O, GPU, and motion control cards, ensuring adaptability for diverse industrial needs.
With a robust design, the DS-1400 Series operates in extreme environments (-40°C to 70°C) and complies with military and railway certifications like MIL-STD-810G and EN 50155. It features a modular architecture with CMI/CFM modules for additional I/O, PoE, and power ignition sensing. High-speed connectivity (10GbE LAN, USB 3.2), multiple storage options, and quad independent displays make it an all-in-one solution for demanding applications in manufacturing, railways, and IoT.
Specifications of DS-1400 Series Rugged Embedded Computer:
Model Name | DS-1400 | DS-1401 | DS-1402 | |
System | Processor | • 13th Generation Intel® Raptor Lake-S Series CPU: – Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W – Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W – Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W – Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W – Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W – Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W – Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W – Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W – Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W• 12th Generation Intel® Alder Lake-S Series CPU: – Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W – Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W – Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W – Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W – Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W – Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W – Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W – Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W – Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W – Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W – Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W – Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
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Chipset | • Intel R680E Chipset | |||
Memory | • 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64GB | |||
BIOS | • AMI BIOS | |||
Graphics | Graphics Engine | • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
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Maximum Display Output | • Supports Quad Independent Display | |||
VGA | • 1x VGA Connector : 1920 x 1080 @ 60Hz | |||
DP | • 2x DP Connector : 4096 x 2304 @ 60Hz * Verified maximum DP resolution: 3840×2160 @ 60Hz |
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HDMI | • 1x HDMI Connector : 4096×2160 @ 30Hz * Verified maximum resolution: 3840×2160 @ 30Hz |
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Audio | Audio Codec | • Realtek® ALC888, High Definition Audio | ||
Line-out | • 1 x Line-out, Phone Jack 3.5mm | |||
Mic-in | • 1 x Mic-in, Phone Jack 3.5mm | |||
I/O | LAN | • 2 x GbE LAN, RJ45 – GbE1: Intel® I219 – GbE2: Intel® I210 |
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COM | • 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 | |||
USB | • 2 x USB 3.2 Gen2x1 (10Gbps), Type A • 4 x USB 3.2 Gen1x1 (5Gbps), Type A • 2 x USB 2.0 (480Mbps), Type A |
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PS/2 | • 1 x PS/2, 6 Pin Mini-DIN Female Connector | |||
Storage | SSD/HDD | • 1x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 ) • 1x 2.5” Internal SATA HDD/SSD Bay ( SATA 3.0 ) |
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mSATA | • 3x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket ) | |||
M.2 SSD | • 1x M.2 Key M Type 2280 Socket, Support PCIe Gen3 x4 NVMe SSD or SATA SSD ( SATA 3.0 ) | |||
RAID | • Support RAID 0/1/5/10 | |||
Expansion | PCI Express | • 1 x PCI/PCIe Expansion Slot with Optional Riser Card * Supports maximum dimensions of add-on card (H x L) : 111 x 235 mm |
• 2 x PCI/PCIe Expansion Slot with Optional Riser Card * Supports maximum dimensions of add-on card (H x L) : 111 x 235 mm |
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Mini PCI Express | • 3 x Full-size Mini-PCIe Socket | |||
SIM Socket | • 2 x SIM Socket | |||
CMI (Combined Multiple I/O) Interface | • 2 x High Speed CMI Interface for optional CMI Module Expansion • 2 x Low Speed CMI Interface for optional CMI Module Expansion |
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CFM (Control Function Module) Interface | • 1 x CFM IGN Interface for optional CFM-IGN Module Expansion | |||
Other Function | External FAN Connector | • 1 x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) | ||
Power Ignition Sensing | • Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module) | |||
Clear CMOS Switch | • 1 x Clear CMOS Switch | |||
Reset Button | • 1 x Reset Button | |||
Instant Reboot | • Support 0.2sec Instant Reboot Technology | |||
Watchdog Timer | • Software Programmable Supports 256 Levels System Reset | |||
Power | Power Button | • 1 x ATX Power On/Off Button | ||
Power Mode Switch | • 1 x AT/ATX Mode Switch | |||
Power Input | • 9 – 48VDC, 3-pin Terminal Block | |||
Remote Power On/Off | • 1 x Remote Power On/Off, 2-pin Terminal Block | |||
Remote Power LED | • 1 x Remote Power LED, 2-pin Terminal Block | |||
Max. Power Consumption | • 35W CPU – OS Idle Mode: 92.52W – Full Loading: 206.93W • 65W CPU – OS Idle Mode: 105.70W – Full Loading: 250.56W |
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Inrush Current (Peak) | • 35W CPU: 6.283 A@24V • 65W CPU: 6.655 A@24V |
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Physical | Dimension ( W x D x H ) | • 227 x 261 x 88 mm | • 227 x 261 x 108 mm | • 227 x 261 x 128 mm |
Weight Information | • 4.5 KG | • 5.02 KG | • 5.44 KG | |
Mechanical Construction | • Extruded Aluminum with Heavy Duty Metal | |||
Mounting | • Wall | |||
Physical Design | • Fanless Design • Cableless Design • Jumper-less Design • Unibody Design |
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Reliability & Protection | Reverse Power Input Protection | • Yes | ||
Over Voltage Protection | • Protection Range: 51~58V • Protection Type: shut down operating voltage, re-power on at the preset level to recover |
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Over Current Protection | • 15A | |||
CMOS Battery Backup | • SuperCap Integrated for CMOS Battery Maintenance-free Operation | |||
MTBF | • 371,274 Hours – Database: Telcordia SR-332 Issue 3, Method 1, Case 3 |
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Operating System | Windows | • Windows®11, Windows®10 | ||
Linux | • Ubuntu 22.04 | |||
Environment | Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 65W TDP Processor: -40°C to 50°C (With External Fan Kit) – With extended temperature peripherals; Ambient with air flow – According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
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Storage Temperature | • -40°C to 85°C | |||
Relative Humidity | • 95%RH @ 70°C (non-Condensing) | |||
Shock | • MIL-STD-810G | |||
Vibration | • MIL-STD-810G | |||
EMC | • CE, UKCA, FCC, ICES-003 Class A • EN 50155 (EN 50121-3-2 Only) |
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EMI | • CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
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EMS | • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV • EN/IEC 61000-4-6 CS: 10V • EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz |
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Safety | • UL, cUL, CB, IEC, EN 62368-1 |
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