Description
The GP-3100 Modular GPU Computer is a cutting-edge solution for industrial AI and machine vision applications. Featuring Intel® 14th/13th/12th Gen Core™ processors and dual full-length GPU support (up to 500W), it delivers exceptional performance for complex edge AI computing tasks. Equipped with 5600MHz DDR5 ECC memory and modular I/O expansion capabilities, the GP-3100 offers unmatched scalability and flexibility.
This rugged system is designed for demanding environments, with a wide operating temperature range (-40°C to 70°C), versatile mounting options, and compliance with industry standards like MIL-STD-810H and EN 50155. The patented GPU Expansion Box supports high-performance GPUs with secure mounting for stability in high-vibration conditions. Advanced cooling ensures efficient heat dissipation under full workloads, making the GP-3100 ideal for applications requiring robust performance and reliability.
Ultimate CPU + GPU performanceEquipped with a 14th generation Intel® Core™ (Raptor Lake-S Refresh) processor, the GP-3100 is capable of three times the computing performance of its predecessor. The GP-3100 supports up to two 250W high-end GPU cards and 5600MHz DDR5 memory with ECC for a complete AI computing solution. |
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Scalable and upgradeable GPU expansion boxThe dual-patented GPU expansion box (GEB) supports up to two 328mm high-end full-length GPU cards and includes multiple built-in PCIe slots for flexible use with high-speed I/O or frame grabber cards. The patented adjustable 3D GPU Card Mounting Bracket is designed for high-vibration environments and can firmly lock all GPU cards. For flexible future upgrades, the GEB can be replaced to add a higher-end GPU card or an expansion card. Patent No.: I779496, I763318 |
Comprehensive cooling designTo solve the power consumption and thermal challenges, the GP-3100’s mechanical structure and isolated external smart fan kits on both sides of the chassis effectively dissipate heat under full workloads in extreme conditions. Patent No.: I778522 |
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Rich modular design and expandabilityAI applications need high-speed transmission and high-capacity storage, so the GP-3100 has 4x 2.5GbE LAN, 6x USB 3.2, 4x front-accessible 2.5” HDD/SSD, and NVMe SSD. Rich scalability capabilities include exclusive modular technology (CMI and CFM) and an M.2 slot that supports CAN bus and other modules to meet various application needs. |
International standards and certificationsRugged design passes or complies with multiple industrial standards and certifications, including MIL-STD-810H US military shock resistance, E-mark, and EN 50155 (EN 50121-3-2 only), to ensure high reliability in various application environments. |
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Specifications of GP-3100 Modular GPU Computer:
| Model Name | GP-3100 | |
| System | Processor | 14th Generation Intel® Raptor Lake-S Refresh Series CPU (Coming Soon) 13th Generation Intel® Raptor Lake-S Series CPU: • Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W • Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W • Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W • Intel® Core™ i5-13400E 10 Cores Up to 4.6 GHz, TDP 65W • Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W • Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W • Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W • Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W • Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W 12th Generation Intel® Alder Lake-S Series CPU: • Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W • Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W • Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W • Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W • Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W • Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W • Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W • Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W • Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W • Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W • Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W • Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
| Chipset | • Intel R680E Chipset | |
| Memory | • 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64 GB | |
| BIOS | • AMI BIOS | |
| Graphics | Graphics Engine | • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
| Maximum Display Output | • Supports Triple Independent Display | |
| HDMI | • 1x HDMI Connector (3840 x 2160@30Hz) * Verified maximum resolution: 3840×2160 @ 30Hz |
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| DP | • 1x DisplayPort Connector (4096 x 2304@60Hz) * Verified maximum DP resolution: 3840×2160 @ 60Hz |
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| VGA | • 1x VGA Connector (1920 x 1200 @60Hz) | |
| Audio | Audio Codec | • Realtek® ALC888, High Definition Audio |
| Line-out | • 1x Line-out, Phone Jack 3.5mm | |
| Mic-in | • 1x Mic-in, Phone Jack 3.5mm | |
| I/O | LAN | • 4x 2.5GbE LAN, RJ45 (Intel I225) • 1x 1GbE LAN, RJ45 (Intel I219) |
| COM | • 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 | |
| USB | • 6x USB 3.2 Gen1x1 (5Gbps), Type A | |
| Storage | SSD/HDD | • 4x 2.5” Front Accessible SATA HDD/SSD Drive Bay ( SATA3.0 ) (up to 15mm in Height) |
| M.2 SSD | • 1x M.2 SSD Shared by M.2 Key M Type 2280 Socket, Support PCIe Gen 4×4 NVMe SSD or SATA 3.0 SSD • 1x M.2 SSD Shared by M.2 Key B Type 3042/3052 Socket, Support PCIe Gen 3×2 NVMe SSD or SATA 3.0 SSD |
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| RAID | • Supports RAID 0 / 1 / 5 / 10 | |
| Expansion | PCIe | • Optional GPU Expansion Box – 1 x PCIe x4 + 1 x PCIe x16 – 2 x PCIe x16 (8Lanes) + 1 x PCIe x1 + 1 x PCIe x4 |
| SIM Socket | • 2 x Front Accessible SIM Socket | |
| M.2 E Key Socket | • 1x M.2 Key E Type 2230 Socket (PCIe Gen 3×2), Support Wireless/Intel CNVi Module Expansion | |
| M.2 B Key Socket | • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3×2 / USB3.2 Gen1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion • 1x M.2 Key B Type 2280 Socket (PCIe Gen 3×1), Support Add-on Card Expansion |
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| CMI (Combined Multiple I/O) Interface | • 1 x High Speed CMI Interface for optional CMI Module Expansion • 1 x Low Speed CMI Interface for optional CMI Module Expansion |
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| CFM (Control Function Module) Interface | • 1x CFM IGN Interface for optional CFM-IGN Module Expansion • 1x CFM PoE Interface for optional CFM-PoE Module Expansion |
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| Other Function | FAN | • 2x Fan Kits ( Air-flow isolated from the electronics ) |
| Power Ignition Sensing | • Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module) | |
| Clear CMOS Switch | • 1x Clear CMOS Switch | |
| Reset Button | • 1x Reset Button | |
| Instant Reboot | • Support 0.2sec Instant Reboot Technology | |
| Watchdog Timer | • Software Programmable Supports 256 Levels System Reset | |
| Antenna Holes | • 7x Antenna Holes | |
| Power | Power Button | • 1x ATX Power On/Off Button |
| Power Input Voltage | • 9 – 48VDC, Single Power Input | |
| Connector | • 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A – Dual power connect must be used at the same time due to 15A current limitation at each power connector. |
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| Power Mode Switch | • 1x AT/ATX Mode Switch | |
| Remote Power On/Off | • 1x Remote Power On/Off, 2-pin Terminal Block | |
| Remote Power LED | • 1x Remote Power LED, 2-pin Terminal Block | |
| Max. Power Consumption | • 35W CPU: 201.05W • 65W CPU: 306.48W – Test conducted with CPU, 1x RAM, and 1x storage – 100% load during burn-in testing. |
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| Physical | Dimension ( W x D x H ) | • 105 x 195 x 370 mm |
| Weight Information | • 7.7 Kg | |
| Mechanical Construction | • Extruded Aluminum with Heavy Duty Metal | |
| Mounting | • Versatile Mounting Methods (Tower Stand / Desktop / 19”Rack / Flat / Wall Mount) | |
| Physical Design | • Jumper-less Design • Unibody Design |
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| Reliability & Protection | Reverse Power Input Protection | • Yes |
| Over Voltage Protection | • Protection Range: 51~58V • Protection Type: shut down operating voltage, re-power on at the preset level to recover |
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| Over Current Protection | • 30A | |
| CMOS Battery Backup | • SuperCap Integrated for CMOS Battery Maintenance-free Operation | |
| MTBF | • 432,065 Hours – Database: Telcordia SR-332 Issue3, Method 1, Case 3 |
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| Operating System | Windows | • Windows®11, Windows®10 |
| Linux | • Ubuntu Desktop 22.04 LTS | |
| Environment | Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 65W TDP Processor with external FAN: -40°C to 60°C * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | • -40°C to 70°C | |
| Relative Humidity | • 95%RH @ 70°C (non-Condensing) | |
| Shock | • MIL-STD-810H | |
| Vibration | • MIL-STD-810H | |
| EMC | • CE, UKCA, FCC, ICES-003 Class A • EN 50155 (EN 50121-3-2 Only) • E-mark (Pending) |
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| EMI | • CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
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| EMS | • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV • EN/IEC 61000-4-6 CS: 10V • EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz |
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| Fire Protection | • EN 45545-2 | |
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