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Pre – mold in Poly Ethelene wrapped 360˚ with copper tape terminated to shield, over molded in black PVC.
Meets Automated Imaging Association Camera Link Standard. Skew-within pair: 35 ps/m max Skew-channel skew per chipset: 50 ps/m max. All cables are Camera Link approved.
Preconfigured embedded I/O Functions: 24-CH Discrete I/O, 8-CH ARINC 429/575, 4-CH CANBus (programmable for CAN 2.0A/B, ARINC 825 or CAN FD protocol) and 2-CH MIL-STD-1553
Ethernet switch module that offers four (4) 10GBase-SR multimode fiber optic ports and sixteen (16) 10/100/1000Base-T Ethernet ports
Supports One NAI smart I/O function module
Minimized SWaP Footprint
Xilinx UltraScale+ SoC with Dual/Quad Core ARM Cortex®-A53 processors