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The GEODE rugged computer system platform offers easy customization and quick availability for rugged computers due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O, plus the use of COM Express modules to support flexible CPU choices. In addition to the standard computer I/O features, GEODE supports up to 3 I/O boards with up to 110 additional I/O signals without requiring any change to the enclosure or cabling. The elimination of custom enclosure and cabling design efforts dramatically reduces up-front costs and delivery times, and the resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.
The COM is thermally coupled to the top surface of the enclosure with a conduction cooling heat spreader and mounting plate. (Heat spreader removed for illustration purposes, normally present in the open rectangle in the mounting plate)
The optional filtered 80-watt power supply is thermally coupled to the bottom surface of the enclosure using a conduction cooling mounting plate with thermal pads on both sides.
The entire system is housed in a rugged 3-part enclosure that eliminates all T joints and includes seals at all joints to ensure IP67 compliance.
Key Features
Easy customization and quick ship due to elimination of bulky cables and custom case & cable design
COM Express architecture provides performance scalability and earlier access to latest generation processors
Base model includes 11th Gen Core i7 CPU, 32GB RAM, HDMI, 2x GbE, 2x USB 3.0, 2x USB 2.0, 4x RS-232/422/485
Expandable with PCIe/104 and minicard I/O modules
Standard model can support 1 LC fiber port and up to 110 I/O expansion signals
IP67 sealed construction with fully gasketed design
High-speed rugged circular connectors support reliable HDMI and USB 3.0 signaling; MIL-DTL-38999 connectors used for remaining I/O
MIL-STD-810H shock/vibration rated
MIL-STD-461 / 704 / 1275 compliant power supply with 9-60VDC input and isolation
-40 to +80C operating temperature
9.1 x 0.7 x 4.1 in / 230 x 179 x 104 mm WxDxH
5.8 lbs / 2.6Kg base model
Key Benefits
Easy Customization: Add up to 110 I/O signals without changing the enclosure or cabling.
Flexible CPU Choices: COM Express modules allow for a range of CPU options.
Cost-Effective: Reduces up-front design costs and shortens delivery times with pre-integrated components.
High Durability: Rugged enclosure with IP67 compliance ensures reliable operation in harsh environments.
Thermal Efficiency: Conduction cooling with heat spreader and mounting plate for optimal thermal management.
Scalable I/O: Supports a wide range of I/O modules, from low-cost minicards to high-performance graphics and Ethernet.
Quick Deployment: Common components and pre-integrated features enable rapid deployment and production of small quantities.
Trust the Experts at Integrys
For more than 50 years, Integrys has been the industry leader in selecting and evaluating rugged and embedded computers, imaging and video technology and engineering solutions.
Specifications
GEODE is based on Diamond’s JASPER COM Express carrier board featuring a high level of I/O as well as multiple sockets for I/O expansion. The optional integrated data acquisition circuit provides high-accuracy analog I/O with autocalibration and programming library support. Dual minicard sockets and a PCIe/104 socket with PCIe x1 and x16 links (depending on the installed COM) enable feature upgrade with the widest range of I/O modules, from low-cost minicards up to high-performance graphics and 10Gb Ethernet, all without modifying the case or cables.
