Description
The DV-1100 Rugged Embedded Computer is a compact yet powerful edge computing solution built on the 13th/12th Gen Intel® Core™ processor platform. Designed for industrial environments, it balances high performance with cost efficiency, making it ideal for smart manufacturing, railway computing, machine vision, and IoT applications. With a compact size (224.1 x 162 x 62 mm), it fits into space-constrained setups while offering wide operating temperatures (-40°C to 70°C) and meeting industrial and military standards like MIL-STD-810H.
Featuring a modular design, the DV-1100 supports multiple M.2 slots for storage, 5G, and wireless expansion, along with high-speed I/O, including 2.5GbE LAN and 10Gbps USB 3.2 Gen2. Its rugged unibody design ensures reliable operation under extreme conditions, while flexible mounting options and extensive certifications make it suitable for diverse industrial applications.
Specifications of DV-1100 Rugged Embedded Computer:
Model Name | DV-1100 | |
System | Processor | 13th Generation Intel® Raptor Lake-S Series CPU: • Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W • Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W • Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W • Intel® Core™ i5-13400E 10 Cores Up to 4.6 GHz, TDP 65W • Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W • Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W • Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W • Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W • Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W12th Generation Intel® Alder Lake-S Series CPU: • Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W • Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W • Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W • Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W • Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W • Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W • Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W • Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W • Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W • Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W • Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W • Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
Chipset | • Intel H610E Chipset | |
Memory | • 1x DDR5 4800MHz SO-DIMM Socket Supports Un-buffered and non-ECC Type, Up to 32GB |
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BIOS | • AMI BIOS | |
Graphics | Graphics Engine | • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
Maximum Display Output | • Supports Triple Independent Display | |
DP | • 1x DisplayPort Connector: 3840 x 2160 @60Hz | |
VGA | • 1x VGA Connector: 1920 x 1200 @60Hz | |
CMI Display | • 1x CMI Interface for Optional CMI-DP/CMI-HDMI Module Expansion | |
Audio | Audio Codec | • Realtek® ALC888, High Definition Audio |
Line-out | • 1 x Line-out, Phone Jack 3.5mm | |
Mic-in | • 1 x Mic-in, Phone Jack 3.5mm | |
I/O | LAN | • 1x 2.5GbE LAN, RJ45 – Intel® I225 • 1x 1GbE LAN, RJ45 – Intel® I219 |
COM | • 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 | |
USB | • 1x 10Gbps USB3.2 Gen 2×1, Type A • 2x 5Gbps USB3.2 Gen 1×1, Type A • 3x 480Mbps USB2.0, Type A |
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Storage | SSD/HDD | • 1x 2.5″ SATA HDD/SSD Bay (SATA 3.0) |
M.2 SSD | • 1x M.2 SSD Shared by M.2 Key M Type 2280 Socket, Support PCIe Gen 4×4 NVMe SSD or SATA 3.0 SSD • 2x M.2 SSD Shared by M.2 Key B Socket, Support PCIe Gen 3×2 NVMe SSD or SATA 3.0 SSD |
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Expansion | M.2 Key E Socket | • 1x M.2 Key E Type 2230 Socket (PCIe Gen 3×2 / USB2.0), Support Wireless/Intel CNVi Module Expansion |
M.2 Key B Socket | • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3×2 / USB3.2 Gen2 x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion • 1x M.2 Key B Type 2242 Socket (PCIe Gen 3×2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion |
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SIM Socket | • 1x Front Accessible Dual Nano SIM Socket | |
CMI (Combined Multiple I/O) Interface | • 1x CMI Interface for optional CMI-Display Module Expansion • 2x CMI Interface for optional CMI-COM/DIO Module Expansion |
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CFM (Control Function Module) Interface | • 1x CFM IGN Interface for optional CFM-IGN Module Expansion | |
Other Function | External FAN Connector | • 1x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) |
Clear CMOS Switch | • 1x Clear CMOS Switch | |
Reset Button | • 1x Reset Button | |
Instant Reboot | • Support 0.2sec Instant Reboot Technology | |
Watchdog Timer | • Software Programmable Supports 256 Levels System Reset | |
Antenna Hole | • 5x Antenna Holes | |
Power | Power Button | • 1 x ATX Power On/Off Button |
Power Mode Switch | • 1 x AT/ATX Mode Switch | |
Power Input | • 9 – 48VDC, 3-pin Terminal Block | |
Remote Power On/Off | • 1 x Remote Power On/Off, 2-pin Terminal Block | |
Remote Power LED | • 1 x Remote Power LED, 2-pin Terminal Block | |
Max. Power Consumption | • 35W CPU – OS Idle Mode: 87.34 W – Full Loading: 204.46 W • 65W CPU – OS Idle Mode: 91.18 W – Full Loading: 307.92 W |
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Inrush Current (Peak) | • 35W CPU: 4.362 A@24V • 65W CPU: 4.516 A@24V |
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Physical | Dimension ( W x D x H ) | • 224.1 x 162 x 62 mm |
Weight Information | • 2.52 KG | |
Mechanical Construction | • Extruded Aluminum with Heavy Duty Metal | |
Mounting | • Wall / DIN-RAIL / VESA Mount | |
Physical Design | • Fanless Design • Cableess Design • Jumper-less Design • Unibody Design |
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Reliability & Protection | Reverse Power Input Protection | • Yes |
Over Voltage Protection | • Protection Range: 51~58V • Protection Type: shut down operating voltage, re-power on at the preset level to recover |
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Over Current Protection | • 15A | |
CMOS Battery Backup | • SuperCap Integrated for CMOS Battery Maintenance-free Operation | |
MTBF | • 413,236 Hours – Database: Telcordia SR-332 Issue3, Method 1, Case 3 |
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Operating System | Windows | • Windows®11, Windows®10 |
Linux | • Ubuntu 22.04 | |
Environment | Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 65W TDP Processor: -40°C to 55°C (With External Fan Kit) * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
Storage Temperature | • -40°C to 70°C | |
Relative Humidity | • 95% RH @ 70°C (Non-condensing) | |
Shock | • MIL-STD-810H | |
Vibration | • MIL-STD-810H | |
EMC | • CE, UKCA, FCC, ICES-003 Class A • EN IEC 61000-6-4 / EN IEC 61000-6-2 (24VDC Input Only) • EN 50155 (EN 50121-3-2 Only) • E-mark |
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EMI | • CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN 61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
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EMS | • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV • EN/IEC 61000-4-6 CS: 10V (**Compliant with the standard when utilizing shielded cable.) • EN/IEC 61000-4-8 PFMF: 50 Hz, 30A • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz |
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Safety | UL, cUL, CB, IEC, EN 62368-1 |
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