Description
The GM-1100 Embedded GPU Computer is a compact, rugged platform designed for high-performance computing and AI-driven edge applications. Equipped with Intel® 14th/13th/12th Gen Core™ processors, it delivers up to 3x the computing power of its predecessors, supporting MXM 3.1 Type A/B GPU modules for advanced AI inference. Its modular design includes M.2 slots for wireless communication, 5G, and high-speed NVMe SSD storage, ensuring flexibility across various use cases.
With advanced cooling technology and industrial-grade protections, the GM-1100 ensures stable operation in extreme environments (-40°C to 70°C). Native 2.5GbE LAN and USB 3.2 Gen2x2 Type-C ports enable seamless data transmission, while compliance with MIL-STD-810H and EN 50121-3-2 standards guarantees reliability in mobility and industrial settings. Compact (260 x 200 x 85 mm) and versatile, the GM-1100 is the ultimate choice for edge AI and GPU-intensive workloads.
3X Performance boostEquipped with a 14th generation Intel® Core (Raptor Lake-S Refresh) processor, the GM-1100 is capable of three times the computing performance of its predecessor. For highly complex or specialized tasks the hybrid or P-core monolithic architecture can be chosen for the best performance based on specific needs. |
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MXM GPU moduleType A and B MXM GPU modules allow comprehensive options to suit lightweight AI or high-performance AI inference applications. The special modular design also means painless upgrades to higher-end MXM modules to bolster performance in the future. |
High-speed connections and
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Ideal for mobility applicationsCompact size (260 x 200 x 85 mm), multiple M.2 expansion slots for 5G of Wi-Fi communication modules, and compliance with rail transit certification (EN50121-3-2) and vehicle certification (E-mark) make the GM-1100 ideal for mobility applications.
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Superior cooling performanceThe innovative thermal design improves system cooling by providing independent heat dissipation channels for the CPU and GPU to the upper cover and sides of the extruded aluminum case. Combined with an external fan, it provides a solid foundation for stable and reliable operation. |
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Rugged safetyThe harsh challenges of the Edge AI environment are overcome with industrial grade wide temperature (-40 to 70°C) and wide voltage (9 to 48 VDC) support, and passing the US military shock standard (MIL-STD-810H) to ensure product stability and safety.
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Specifications of GM-1100 Embedded GPU Computer:
| Model Name | GM-1100 | |
| System | Processor | 14th Generation Intel® Raptor Lake-S Refresh Series CPU (Coming Soon) 13th Generation Intel® Raptor Lake-S Series CPU: • Intel® Core™ i9-13900E 24 Cores Up to 5.2 Ghz, TDP 65W • Intel® Core™ i7-13700E 16 Cores Up to 5.1 Ghz, TDP 65W • Intel® Core™ i5-13500E 14 Cores Up to 4.6 Ghz, TDP 65W • Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W • Intel® Core™ i3-13100E 4 Cores Up to 4.4 Ghz, TDP 65W • Intel® Core™ i9-13900TE 24 Cores Up to 5.0 Ghz, TDP 35W • Intel® Core™ i7-13700TE 16 Cores Up to 4.8 Ghz, TDP 35W • Intel® Core™ i5-13500TE 14 Cores Up to 4.5 Ghz, TDP 35W • Intel® Core™ i3-13100TE 4 Cores Up to 4.1 Ghz, TDP 35W 12th Generation Intel® Alder Lake-S Series CPU: • Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W • Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W • Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W • Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W • Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W • Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W • Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W • Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W • Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W • Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W • Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W • Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
| Chipset | • Intel R680E Chipset | |
| Memory | • 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64 GB | |
| BIOS | • AMI BIOS | |
| Graphics | Graphics Engine | • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
| Maximum Display Output | • Supports Triple Independent Display | |
| DP | • 1x DisplayPort Connector (4096 x 2304@60Hz) *Verified maximum resolution: 3840×2160@ 60Hz |
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| HDMI | • 1x HDMI Connector (4096 x 2160@30Hz) *Verified maximum resolution: 3840×2160@ 30Hz |
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| VGA | • 1x VGA Connector (1920 x 1200 @60Hz) | |
| Audio | Audio Codec | • Realtek® ALC888, High Definition Audio |
| Line-out | • 1x Line-out, Phone Jack 3.5mm | |
| Mic-in | • 1x Mic-in, Phone Jack 3.5mm | |
| I/O | LAN | • 1x 2.5GbE LAN, RJ45 – Intel® I225 • 1x 1GbE LAN, RJ45 – Intel® I219 |
| COM | • 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 | |
| USB | • 1x 20Gbps USB3.2 Gen2 x2, Type C • 3x 10Gbps USB3.2 Gen2 x1, Type A • 4x 5Gbps USB3.2 Gen1 x1, Type A |
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| Storage | SSD/HDD | • 2x 2.5” Front Accessible SATA HDD/SSD Drive Bay ( SATA3.0 ) (up to 15mm in Height) |
| M.2 SSD | • 1x M.2 Key M Type 2280 Socket, Support PCIe Gen4 x4 NVMe SSD or SATA SSD (SATA3.0) • 1x M.2 SSD Shared by M.2 Key B Type 3052 Socket, Support PCIe Gen 3×2 NVMe SSD or SATA SSD (SATA3.0) • 2x M.2 SSD Shared by M.2 Key B Type 2242 Socket, Support PCIe Gen 4×2 NVMe SSD or SATA SSD (SATA3.0) |
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| RAID | • Support RAID 0/1/5/10 | |
| Expansion | MXM Socket | • 1x MXM Carrier Board Socket for MXM GPU Module Expansion |
| M.2 E Key Socket | • 1x M.2 Key E Type 2230 Socket (PCIe Gen 3×2 / USB2.0), Support Wireless/Intel CNVi Module Expansion | |
| M.2 B Key Socket | • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3×2 / USB3.2 Gen2x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion • 2x M.2 Key B Type 2242 Socket (PCIe Gen 4×2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion |
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| SIM Socket | • 2x SIM Socket | |
| CMI (Combined Multiple I/O) Interface | • 1x High Speed CMI Interface for optional CMI Module Expansion • 1x Low Speed CMI Interface for optional CMI Module Expansion |
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| CFM (Control Function Module) Interface | • 1x CFM IGN Interface for optional CFM-IGN Module Expansion | |
| Other Function | External FAN Connector | • 2x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) |
| Power Ignition Sensing | • Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module) |
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| Clear CMOS Switch | • 1x Clear CMOS Switch | |
| Reset Button | • 1x Reset Button | |
| Instant Reboot | • Support 0.2sec Instant Reboot Technology | |
| Watchdog Timer | • Software Programmable Supports 256 Levels System Reset | |
| Antenna Holes | • 2x Antenna Holes | |
| Status LED Indicator | • HDD LED、GPIO LED、IGN LED、GPU LED、Ethernet LED | |
| Power | Power Button | • 1x ATX Power On/Off Button |
| Power Mode Switch | • 1x AT/ATX Mode Switch | |
| Power Input | • 9-48 VDC, Single Power Source Connector Type: 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A • Power input voltage from 9V to 23V must use dual power connectors, power input voltage from 24V to 48V can use single power connector |
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| Remote Power On/Off | • 1x Remote Power On/Off, 2-pin Terminal Block | |
| Max. Power Consumption | • 35W CPU: 187.51W • 65W CPU: 258.96W – Test conducted with CPU, 1x RAM, and 1x storage – 100% load during burn-in testing. |
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| Physical | Dimension ( W x D x H ) | • 260 x 200 x 85 mm |
| Weight Information | • 4.73 kg | |
| Mechanical Construction | • Extruded Aluminum with Heavy Duty Metal | |
| Mounting | • Wall / Side / DIN-RAIL / VESA Mount | |
| Physical Design | • Fanless Design • Cableless Design • Jumper-less Design • Unibody Design |
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| Reliability & Protection | Reverse Power Input Protection | • Yes |
| Over Voltage Protection | • Protection Range: 51~58V • Protection Type: shut down operating voltage, re-power on at the preset level to recover |
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| Over Current Protection | • 30A | |
| CMOS Battery Backup | • SuperCap Integrated for CMOS Battery Maintenance-free Operation | |
| MTBF | • 313,541 Hours – Database: Telcordia SR-332 Issue3, Method 1, Case 3 |
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| Operating System | Windows | • Windows®11, Windows®10 |
| Linux | • Ubuntu Desktop 22.04 LTS | |
| Environment | Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 65W TDP Processor with external FAN: (TBC) * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * For GM-1100 + MXM GPU Module operating temperature, please refer to the last page – Operating Temperature Matrix Table for more information (TBC) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | • -40°C to 70°C | |
| Relative Humidity | • 95%RH @ 70°C (non-Condensing) | |
| Shock | • MIL-STD-810H | |
| Vibration | • MIL-STD-810H | |
| EMC | • CE, UKCA, FCC, ICES-003 Class A • EN 50155 (EN 50121-3-2 Only) • E-mark (Pending) |
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| EMI | • CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN 61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
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| EMS | • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV • EN/IEC 61000-4-6 CS: 10V (**Compliant with the standard when utilizing shielded cable.) • EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz |
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