Products

• Supports all I/O features of Jetson Nano / Xavier NX / TX2 NX modules
• Compact size 4.3×3.3″ / 110x85mm
• Single/dual gigabit Ethernet
• 1x USB 3.1, 2x USB 2.0
• HDMI + DisplayPort
• 3x CSI dual lane camera inputs
• 2x serial ports: 1 RS-232 and 1 RS-232/485
• 16 GPIO with 3.3V / 5V compatibility
• 1 CAN port (with NX module)
• M.2 2242/2280 M-Key NVMe flash socket
• Heat sink / fan sink cooling (orderable options)
• Expansion connector for use with standard and custom I/O expansion modules
• 7-24VDC power input
• Supports full temperature range of installed Jetson modules, -25 to +80ºC
• Available as carrier board, subassembly with installed Jetson module and software, or complete system

RISE 4260HD Series with Command Core^TM  H.264 High-Definition, IP68 Camera Positioning System     

• Advanced Optics
• Installation and Interoperability
• Rugged Construction
• Command CoreTM Action Engine
• Provides a full function web server

• 2 x Redundant MIL-STD-1553 Channels
• 8 x ARINC-429/575 Tx/Rx Channels
• 8 x RS-232/422/485 Sync/Async Serial Channels
• 28 VDC Input PSU with 50 ms holdup option

• 2 x Redundant MIL-STD-1553 Channels
• 8 x ARINC-429/575 Tx/Rx Channels
• 8 x RS-232/422/485 Sync/Async Serial Channels
• 28 VDC Input PSU with 50 ms holdup option

with 10 GB Fiber Optic & 1 GB Copper Ethernet Switch

• Preconfigured embedded I/O Functions: 24-CH Discrete I/O, 8-CH ARINC 429/575, 4-CH CANBus (programmable for CAN 2.0A/B, ARINC 825 or CAN FD protocol) and 2-CH MIL-STD-1553
• Ethernet switch module that offers four (4) 10GBase-SR multimode fiber optic ports and sixteen (16) 10/100/1000Base-T Ethernet ports
• Supports One NAI smart I/O function module
• Minimized SWaP Footprint
• Xilinx UltraScale+ SoC with Dual/Quad Core ARM Cortex®-A53 processors
• 28 VDC Input Power Supply (50+ ms Hold-up Option)
• DO-178C & DO-254 DAL A (Contact Factory)
• Cybersecurity & Anti-Tamper (Contact Factory)

6x 3U OpenVPX MOSA Remote Interface Unit

• 2 x MIL-STD-1553 & 8 x ARINC-429 Tx/Rx (CM5)
• 8 x RS-232/422/485 Serial Channels (SC3)
• 8 x CANBus A/B 2.0/CAN-FD/ARINC-825 (CB8)
• 8 x Programmable RTD or Thermocouple measurement (TR1)
• 16 x ±100 VDC A/D Channels (ADF)
• 8 x ±40 VDC 100 mA Digital to Analog Channels (DA3)
• 2 x AC Reference Excitation (AC2)
• 4 x Strain Gage Measurement (SG1)
• 8 x Variable Reluctance/Pulse Counter Measurement Channels (VR1)
• 16 x 10/100/100 Base-T Ethernet Switch (ES2)
• 48 x Discrete Input Channels and 48 Programmable Discrete I/O Channels (68DT1)
• 28 VDC MIL-STD-704 Aircraft Electrical Power Characteristics with at least 50 ms holdup.
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

4x 3U OpenVPX MOSA Remote Interface Unit

• 2 x MIL-STD-1553 & 8 x ARINC-429 Tx/Rx (CM5)
• 8 x RS-232/422/485 Serial Channels (SC3)
• 8 x CANBus A/B 2.0/CAN-FD/ARINC-825 (CB8)
• 8 x Programmable RTD or Thermocouple measurement (TR1)
• 8 x ±40 VDC 100 mA Digital to Analog Channels (DA3)
• 2 x AC Reference Excitation (AC2)
• 4 x Strain Gage Measurement (SG1)
• 8 x Variable Reluctance/Pulse Counter Measurement Channels (VR1)
• 48 x Discrete Input Channels and 48 Programmable Discrete I/O Channels (68DT1)
• 28 VDC MIL-STD-704 Aircraft Electrical Power Characteristics with at least 50 ms holdup.
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

6x 3U OpenVPX MOSA Mission Computer

• 2 x MIL-STD-1553 & 8 x ARINC-429 Tx/Rx (CM5)
• 8 x RS-232/422/485 Serial Channels (SC3)
• 8 x CANBus A/B 2.0/CAN-FD/ARINC-825 (CB8)
• 4 x MIL-STD-1553/1760 (2 x FTJ)
• 4 x Non-Latching Relay (RY1)
• 24 x Enhanced Programmable Discrete I/O Channels (DT4)
• 16 x ±100 VDC A/D Channels (ADF)
• 12 x ±10 VDC or ±25 mA D/A Outputs (DA1)
• 12 x ±1.25 to ±10.0 A/D Channels (AD1)
• 12 x ±100V A/D Channels (AD2)
• 16 x ±1.25 to ±10.0 VDC A/D Channels (AD4)
• 16 x 10/100/100 Base-T Ethernet Switch (ES2)
• 48 x Discrete Input Channels and 48 Programmable Discrete I/O Channels (68DT1)
• 28 VDC Input PSU per VITA 62 (VPX68) Optional 50 ms holdup.
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

4x 3U OpenVPX MOSA Mission Computer

• 2 x MIL-STD-1553 & 8 x ARINC-429 Tx/Rx (CM5)
• 8 x RS-232/422/485 Serial Channels (SC3)
• 8 x CANBus A/B 2.0/CAN-FD/ARINC-825 (CB8)
• 24 x Enhanced Programmable Discrete I/O Channels (DT4)
• 16 x ±100 VDC A/D Channels (ADF)
• 12 x ±10 VDC or ±25 mA D/A Outputs (DA1)
• 16 x 10/100/100 Base-T Ethernet Switch (ES2)
• 48 x Discrete Input Channels and 48 Programmable Discrete I/O Channels (68DT1)
• 28 VDC Input PSU per VITA 62 (VPX68) with Optional 50 ms holdup.
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

2x 3U OpenVPX MOSA Mission Computer

• 2 x MIL-STD-1553 & 8 x ARINC-429 Tx/Rx (CM5)
• 8 x RS-232/422/485 Serial Channels (SC3)
• 8 x CANBus A/B 2.0/CAN-FD/ARINC-825 (CB8)
• 24 x Enhanced Programmable Discrete I/O Channels (DT4)
• 16 x ±100 VDC A/D Channels (ADF)
• 12 x ±10 VDC or ±25 mA D/A Outputs (DA1)
• 28 VDC Input PSU per VITA 62 (VPX68). Optional 50 ms holdup.
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

2x 3U OpenVPX MOSA Flight Control Computer

• 8 x ARINC-429 Tx/Rx & 12 Programmable Discrete IO (CM2)
• 16 x ±100 VDC A/D Channels (ADF)
• 8 x Programmable RS-232/422/485 Serial Channels (SC3)
• 2 x AC Excitation References (AC2)
• 4 x LVDT Measurement Channels (LD2)
• 4 x ±40 VDC 100 mA Digital to Analog Channels (DA3)
• 28 VDC Input PSU per VITA 62 (VPX68) with at least 50 ms holdup
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

Efficient image processing for applications with limited batch sizes

• Detailed inspections with resolutions up to 65 MP
• High throughput with up to 1578 fps
• Complete flexibility with 10GBase-T for M12 copper cables or SFP+ slot for optical cables
• Dynamic adjustment to varying working distances and changing lighting conditions
• Flexible cross-sector solutions for applications
• Reliably capture the minutest details
• Easy, flexible, and cost-effective integration
• Precise image analysis with lasting stability
• Increased reliability coupled with reduced system and integration costs
• Short transmission and response times

• Standard F mount lens suitable for 6k7 and 29Mp camera.
• Perfect image quality from the center to the edge of the image especially in the short WD range.
• Electronics: Component and PCB Inspection
• Factory Automation: Food, Glass, Bottle inspection
• Print: Color inspection

• Compact Design
• Vis/NIR AR Coating
• Resolving Power 130lp/mm, Resolution 4.5μm/pixel
• Full size 35mm format compatible
• Designed for common lens mount
• Connection with ML-TUBE allows flexible magnification adjustment

• Compact Design
• Vis/NIR AR Coating
• Resolving Power 130lp/mm, Resolution 4.5μm/pixel
• Full size 35mm format compatible
• Designed for common lens mount
• Connection with ML-TUBE allows flexible magnification adjustment

Compact Design, Vis/NIR AR Coating

• High contrast and high resolution for 16K3.5µm and 150MP camera
• Designed to cover large format sensors, ≦IF 67mm
• Magnification lineup 0.2x, 0.24x, 0.3x, 0.38x, 0.45x
• Wide band AR coating (400nm～1100nm)
• Designed for common lens mount (V70-mount)