Products

2x 3U OpenVPX MOSA Mission Computer

• 2 x MIL-STD-1553 & 8 x ARINC-429 Tx/Rx (CM5)
• 8 x RS-232/422/485 Serial Channels (SC3)
• 8 x CANBus A/B 2.0/CAN-FD/ARINC-825 (CB8)
• 24 x Enhanced Programmable Discrete I/O Channels (DT4)
• 16 x ±100 VDC A/D Channels (ADF)
• 12 x ±10 VDC or ±25 mA D/A Outputs (DA1)
• 28 VDC Input PSU per VITA 62 (VPX68). Optional 50 ms holdup.
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

2x 3U OpenVPX MOSA Flight Control Computer

• 8 x ARINC-429 Tx/Rx & 12 Programmable Discrete IO (CM2)
• 16 x ±100 VDC A/D Channels (ADF)
• 8 x Programmable RS-232/422/485 Serial Channels (SC3)
• 2 x AC Excitation References (AC2)
• 4 x LVDT Measurement Channels (LD2)
• 4 x ±40 VDC 100 mA Digital to Analog Channels (DA3)
• 28 VDC Input PSU per VITA 62 (VPX68) with at least 50 ms holdup
• MIL-STD-810G, MIL-STD-461F and DO-160 environmental and EMI/EMC qualifications.

Efficient image processing for applications with limited batch sizes

• Detailed inspections with resolutions up to 65 MP
• High throughput with up to 1578 fps
• Complete flexibility with 10GBase-T for M12 copper cables or SFP+ slot for optical cables
• Dynamic adjustment to varying working distances and changing lighting conditions
• Flexible cross-sector solutions for applications
• Reliably capture the minutest details
• Easy, flexible, and cost-effective integration
• Precise image analysis with lasting stability
• Increased reliability coupled with reduced system and integration costs
• Short transmission and response times

• Standard F mount lens suitable for 6k7 and 29Mp camera.
• Perfect image quality from the center to the edge of the image especially in the short WD range.
• Electronics: Component and PCB Inspection
• Factory Automation: Food, Glass, Bottle inspection
• Print: Color inspection

• Compact Design
• Vis/NIR AR Coating
• Resolving Power 130lp/mm, Resolution 4.5μm/pixel
• Full size 35mm format compatible
• Designed for common lens mount
• Connection with ML-TUBE allows flexible magnification adjustment

• Compact Design
• Vis/NIR AR Coating
• Resolving Power 130lp/mm, Resolution 4.5μm/pixel
• Full size 35mm format compatible
• Designed for common lens mount
• Connection with ML-TUBE allows flexible magnification adjustment

Compact Design, Vis/NIR AR Coating

• High contrast and high resolution for 16K3.5µm and 150MP camera
• Designed to cover large format sensors, ≦IF 67mm
• Magnification lineup 0.2x, 0.24x, 0.3x, 0.38x, 0.45x
• Wide band AR coating (400nm～1100nm)
• Designed for common lens mount (V70-mount)

Compact Design, Vis/NIR AR Coating

• High contrast and high resolution for 16K3.5µm and 150MP camera
• Designed to cover large format sensors, ≦IF 67mm
• Magnification lineup 0.2x, 0.24x, 0.3x, 0.38x, 0.45x
• Wide band AR coating (400nm～1100nm)
• Designed for common lens mount (V70-mount)

Compact Design, Vis/NIR AR Coating

• High contrast and high resolution for 16K3.5µm and 150MP camera
• Designed to cover large format sensors, ≦IF 67mm
• Magnification lineup 0.2x, 0.24x, 0.3x, 0.38x, 0.45x
• Wide band AR coating (400nm～1100nm)
• Designed for common lens mount (V70-mount)

Compact Design, Vis/NIR AR Coating

• High contrast and high resolution for 16K3.5µm and 150MP camera
• Designed to cover large format sensors, ≦IF 67mm
• Magnification lineup 0.2x, 0.24x, 0.3x, 0.38x, 0.45x
• Wide band AR coating (400nm～1100nm)
• Designed for common lens mount (V70-mount)

Compact Design, Vis/NIR AR Coating

• High contrast and high resolution for 16K3.5µm and 150MP camera
• Designed to cover large format sensors, ≦IF 67mm
• Magnification lineup 0.2x, 0.24x, 0.3x, 0.38x, 0.45x
• Wide band AR coating (400nm～1100nm)
• Designed for common lens mount (V70-mount)

• 4 x 8192 pixel prism-based 10GBASE-T line scan camera
• line rate of 36 kHz for RGB8 + NIR dual-stream output
• Prism technology for superior color quality and alignment of visible + NIR channels
• Backwards compatible to NBASE-T (5GBASE-T/2.5GBASE-T) and standard GigE (1000BASE-T)
• New “State of the art” CMOS sensors with 3.75 x 5.78 µm pixels
• Supports vertical dual-line binning, 2x horizontal binning, or both
• ROI capability can increase line rate by reducing number of pixels per line
• Flat field correction and color shading correction
• HSI and XYZ color space conversion
• Supports direct connection to rotary encoders plus large variety of trigger options
• GigE Vision 2.0 interface with choice of single-stream (RGBa8) or dual-stream output
• Color output can be 24/30/32-bit RGB or 8-bit YUV format
• Excellent shock and vibration resistance

• Compact Design
• Vis/NIR AR Coating
• Vibration Resistance
• High resolving power 200lp/mm,High resolution 2.2μm/pixel
• Format size 2/3″ compatible

• I/O breakout from Xavier board:
• 2x USB 3.1
• 2x USB 2.0
• 2x Gigabit Ethernet
• 1x HDMI
• 1x LVDS LCD
• 4x RS-232/RS485/RS422
• 2x CAN 1Mbps
• Audio
• SAM DAQ circuit:
• 6 12-bit A/D, 0-3.3V input range, up to 1MSPS sampling rate
• 2 12-bit D/A, 0-3.3V output range
• 13 GPIO, 3.3V logic levels

• Complete system with Jetson AGX Xavier module and Linux OS installed m
• 2 gigabit Ethernet ports
• 2 HDMI 2.0a/b ports
• 2 USB 3.0 ports with type A connectors
• 2 USB 2.0 ports
• 4 serial ports with RS-232/422/485 (depending on model)
• Camera module connector supporting up to 12 lanes CSI
• 2 optional CAN ports
• 1 Mini PCIe socket with PCIe and USB support
• 1 M.2 2280 PCIe x1 socket
• Input voltage 9-20VDC; 12VDC universal AC adapter included
• Operating temperature -25 to +70°C
• Steel enclosure with aluminum heat sink
• Dimensions: 150 x 112 x 72mm / 5.9 x 4.4 x 2.8″

• I/O breakout from Xavier board:
• 2x USB 3.1
• 2x USB 2.0
• 2x Gigabit Ethernet
• 2x HDMI
• 4x RS-232/RS485/RS422
• 2x CAN
• Audio
• SAM DAQ circuit: 6xADC input to SAM controller and 2x DAC via SAM controller
• Digital IOs: 13 Digital IO via SAM controller